A 3-D Simulator for Silicon Anisotropic Wet Chemical Etching Process Based on Cellular Automata
نویسندگان
چکیده
منابع مشابه
Multiscale modeling of anisotropic wet chemical etching of crystalline silicon
– We combine ab initio and Monte Carlo simulations in multiscale modelling of anisotropic wet chemical etching of silicon. The anisotropy of the macroscopic etching patterns observed in the experiments is explained by two mechanisms at an atomistic scale: the weakening of backbonds following OH termination of surface sites and the existence of significant interaction between the surface-termina...
متن کاملOptical Mems Devices Based on Wet Anisotropic Etching of Silicon
Optical MEMS found various applications over the last years due to the rapidly increasing data rates in optical networks. As standard single-mode fibers are used, the required alignment tolerances are below 1 μm for optical fiber. The assembly and reliability of MOEMS devices requires increasing attention. Additionally, the trend is going from single-functionality devices to more complex subsys...
متن کاملThree-Dimensional Simulation of Anisotropic Wet Chemical Etching Process
In this paper, we present result on the development of a simulation tool for the three-dimensional anisotropic wet chemical etching of bulk silicon etching or bulk micromaching. As a test of our simulation tool, we present several simulation results. Several simulation results demonstrate our simulation tool which is quite efficient for the design and development of MEMS device structure. The d...
متن کاملWet-Chemical Etching and Cleaning of Silicon
A Introduction Research and manufacturing related to silicon devices, circuits, and systems often relies on the wet-chemical etching of silicon wafers. The dissolution of silicon using liquid solutions is needed for deep etching and micromachining, shaping, and cleaning. Also, wet-chemistries are often used for defect delineation in single crystal silicon materials. In this paper, a review of t...
متن کاملA comprehensive review on convex and concave corners in silicon bulk micromachining based on anisotropic wet chemical etching
Wet anisotropic etching based silicon micromachining is an important technique to fabricate freestanding (e.g. cantilever) and fixed (e.g. cavity) structures on different orientation silicon wafers for various applications in microelectromechanical systems (MEMS). {111} planes are the slowest etch rate plane in all kinds of anisotropic etchants and therefore, a prolonged etching always leads to...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Physics: Conference Series
سال: 2006
ISSN: 1742-6588,1742-6596
DOI: 10.1088/1742-6596/34/1/111